共 25 条
- [21] Electric Field Transient Characteristics of High Voltage and High Power Compliant Press-Pack IGBT Device Package Insulation Structure Diangong Jishu Xuebao/Transactions of China Electrotechnical Society, 2023, 38 (23): : 6253 - 6265
- [22] Influence of Parameter Dispersion of Parallel Press-pack IGBT Chips on Its Current Sharing During Turn-on Process Zhongguo Dianji Gongcheng Xuebao/Proceedings of the Chinese Society of Electrical Engineering, 2023, 43 (20): : 8025 - 8037
- [23] Modelling and analysis on short-circuit failure for press-pack IGBT devices used in VSC-HVDC converter JOURNAL OF ENGINEERING-JOE, 2019, (16): : 2753 - 2757
- [24] Influence of Parameter Dispersion of Parallel Press-pack IGBT Chips on Its Current Sharing During Turn-off Process Zhongguo Dianji Gongcheng Xuebao/Proceedings of the Chinese Society of Electrical Engineering, 2024, 44 (05): : 1913 - 1923
- [25] Comparative Analysis of Large-capacity Fully-controlled Press-pack IGBT and IGCT: Principle, Structure, Characteristics and Application Zhongguo Dianji Gongcheng Xuebao/Proceedings of the Chinese Society of Electrical Engineering, 2022, 42 (08): : 2940 - 2956