Novel high-density and high-speed NAND-type electrical erasable programmable read only memory

被引:0
|
作者
Lin, Frank Ruei-Ling [2 ]
Lee, Mao-Lin [2 ]
Lin, Shih-Yun [2 ]
Boe, Chen-Hao [2 ]
Yeh, Ching-Pen [1 ]
Wu, P.-H. [1 ]
Wang, Wen-Sen [1 ]
Ni, James [1 ]
Hsu, Charles Ching-Hsiang [2 ]
机构
[1] Analogy Technology Corporation, Hsinchu, Taiwan
[2] Microlectron. Lab., Dep. of Electrical Engineering, National Tsing Hua University, Hsinchu 300, Taiwan
关键词
Current density - Dynamic random access storage - Electric fields - Electron tunneling - Integrated circuits - Threshold voltage;
D O I
暂无
中图分类号
学科分类号
摘要
A new NAND-type electrical erasable programmable read only memory (EEPROM), which employs (1) the novel in-cell temporary storage (ICTS) technique and (2) the novel multiple-wordline parallel programming (MWPP) method, is proposed to reduce the unit cell size and decrease the overall programming time. The ICTS approach latches input data directly to the selected EEPROM cells by an inverted channel with different input bitline voltages. After all the selected cells are latched to individual data, the MWPP method simultaneously raises all selected wordlines to high voltage to perform FN tunneling for parallel programming. The equivalent byte programming time is considerably reduced by employing parallel programming. The high-speed and high-density features further reduce the EEPROM testing cost for manufacturers and save programming time and cost for system providers.
引用
收藏
页码:2208 / 2214
相关论文
共 50 条
  • [41] 32nm High-density High-speed T-RAM Embedded Memory Technology
    Gupta, Rajesh
    Nemati, Farid
    Robins, Scott
    Yang, Kevin
    Gopalakrishnan, Vasudevan
    Sundarraj, Joseph John
    Chopra, Rajesh
    Roy, Rich
    Cho, Hyun-Jin
    Maszara, W. P.
    Mohapatra, Nihar Ranjan
    Wuu, John
    Weiss, Don
    Nakib, Sam
    [J]. 2010 INTERNATIONAL ELECTRON DEVICES MEETING - TECHNICAL DIGEST, 2010,
  • [42] Hafnium-based FeRAM for Next-generation High-speed and High-Density Embedded Memory
    Chang, Sou-Chi
    Avci, Uygar E.
    [J]. 2022 IEEE SILICON NANOELECTRONICS WORKSHOP (SNW), 2022,
  • [43] A Hybrid ZQ Calibration Design for High-Density Flash Memory Toggle 5.0 High-speed Interface
    Kim, Tongsung
    Kavala, Anil
    Kang, Hyunsuk
    Jo, Youngmin
    Park, Jungjune
    Kang, Kyoungtae
    Chun, Byung-Kwan
    Shin, Dong-Ho
    Jang, Dong-Su
    Jeong, Byunghoon
    Yoon, Chi-weon
    Lee, Jinyub
    Song, Jai Hyuk
    [J]. IEEE ASIAN SOLID-STATE CIRCUITS CONFERENCE (A-SSCC 2021), 2021,
  • [44] A NOVEL CONCEPT FOR HIGH-SPEED TIME SWITCH APPROACHING MEMORY READ CYCLE LIMIT
    YAMAMOTO, Y
    MIYANAGA, H
    KOBAYASHI, Y
    TERADA, Y
    YAMANAKA, N
    [J]. IEEE TRANSACTIONS ON COMMUNICATIONS, 1986, 34 (09) : 953 - 955
  • [45] Radial tilt detection using one beam and its compensation in a high-density read only memory
    Doh, TY
    Ma, BI
    Choi, BH
    Park, IS
    Chung, CS
    Lee, YH
    Kim, SJ
    Shin, DH
    [J]. JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 2001, 40 (3B): : 1680 - 1683
  • [47] A HIGH-SPEED READ ONLY STORE USING THICK MAGNETIC FILMS
    MATICK, RE
    PLESHKO, P
    SIE, C
    TERMAN, LM
    [J]. IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1966, 10 (04) : 333 - &
  • [48] A flexible gate array architecture for high-speed and high-density applications
    Gallia, JD
    Landers, RJ
    Shaw, CH
    Blake, TGW
    Banzhaf, W
    [J]. IEEE JOURNAL OF SOLID-STATE CIRCUITS, 1996, 31 (03) : 430 - 436
  • [49] HIGH-DENSITY MULTILAYER WIRING SUBSTRATE FOR HIGH-SPEED SIGNAL TRANSMISSION
    KAMBE, R
    [J]. AMERICAN CERAMIC SOCIETY BULLETIN, 1992, 71 (06): : 962 - 968
  • [50] HIGH-SPEED, HIGH-DENSITY DEVICES TO DOMINATE ISSCC 83 SESSIONS
    TSANTES, J
    [J]. EDN MAGAZINE-ELECTRICAL DESIGN NEWS, 1983, 28 (04): : 51 - 54