Investigation of polyhydroxy polyamino complexing agent on CMP of TSV wafer

被引：0
|
作者：
Institute of Microelectronics, Hebei University of Technology, Tianjin 300130, China [1 ]
机构：
来源：
Gongneng Cailiao | 2013年 / 24卷 / 3603-3605+3610期
关键词：
D O I：
10.3969/j.issn.1001-9731.2013.24.018
中图分类号：
学科分类号：
摘要：
12
引用
收藏
相关论文
共 37 条
  • [21] Investigation of Evolution Processes of Wafer Profiles With Edge Over Erosion in Copper CMP
    Wu, Lixiao
    Hahn, Sookap
    Yan, Changfeng
    IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 2017, 30 (01) : 69 - 77
  • [22] A FAST AND CMP-FREE TSV PROCESS BASED ON WAFER-LEVEL LIQUID-METAL INJECTION FOR MEMS PACKAGING
    Gu, Jiebin
    Liu, Bingjie
    Yang, Heng
    Li, Xinxin
    2016 IEEE 29TH INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS (MEMS), 2016, : 569 - 572
  • [23] Characterization and Optimization of a TSV CMP Reveal Process using a Novel Wafer Inspection Technique for Detecting Sub-Monolayer Surface Contamination
    Chew, Jason
    Mahajan, Uday
    Bajaj, Rajeev
    Mirshad, Iad
    Newcomb, Robert
    2013 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC), 2013,
  • [24] Characterization and Optimization of a TSV CMP Reveal Process using a Novel Wafer Inspection Technique for Detecting Sub-Monolayer Surface Contamination
    Chew, Jason
    Mahajan, Uday
    Bajaj, Rajeev
    Mirshad, Iad
    Newcomb, Robert
    2013 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC), 2013,
  • [25] Synergistic Effect of Complexing Agent TAD and Corrosion Inhibitor PZ on BTA Removal in Copper Post-CMP Cleaning
    Wang, Jing
    Gao, Baohong
    Zhang, Nannan
    Yan, Han
    ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, 2023, 12 (08)
  • [26] Investigation of step structure in CMP retainer ring to improve within-wafer non-uniformity
    Park, Jinwoo
    Hong, Seokjun
    Lee, Seungjae
    Jin, Yinhua
    Kim, Taesung
    JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY, 2019, 33 (07) : 3391 - 3395
  • [27] Investigation of step structure in CMP retainer ring to improve within-wafer non-uniformity
    Jinwoo Park
    Seokjun Hong
    Seungjae Lee
    Yinhua Jin
    Taesung Kim
    Journal of Mechanical Science and Technology, 2019, 33 : 3391 - 3395
  • [28] Experimental Investigation of High-Performance Wafer Drying Induced by Marangoni Effect in Post-CMP Cleaning
    Li, Changkun
    Zhao, Dewen
    Lu, Xinchun
    ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, 2019, 8 (10) : P557 - P562
  • [29] Investigation of TSV noise coupling in 3D-ICs using an experimental validated 3D TSV circuit model including Si substrate effects and TSV capacitance inversion behavior after wafer thinning
    Sun, X.
    Rack, M.
    Van der Plasl, G.
    Stucchi, M.
    De Vos, J.
    Absil, P.
    Raskin, J-P
    Beyne, E.
    2016 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM (IMS), 2016,
  • [30] Chemical Mechanical Planarization of Cu Pattern Wafer Based Alkaline Slurry in GLSI with R(NH2)n as Complexing Agent
    He, Yangang
    Wang, Jiaxi
    Niu, Xinhuan
    Gan, Xiaowei
    Shi, Rui
    Sun, Ming
    Tan, Baimei
    Liu, Yuling
    ENVIRONMENTAL BIOTECHNOLOGY AND MATERIALS ENGINEERING, PTS 1-3, 2011, 183-185 : 2275 - +
1234