Investigation of polyhydroxy polyamino complexing agent on CMP of TSV wafer

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作者：
Institute of Microelectronics, Hebei University of Technology, Tianjin 300130, China [1 ]
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来源：
Gongneng Cailiao | 2013年 / 24卷 / 3603-3605+3610期
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D O I：
10.3969/j.issn.1001-9731.2013.24.018
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