Investigation of step structure in CMP retainer ring to improve within-wafer non-uniformity

被引：4

作者：

Park, Jinwoo ^{[1
]}

Hong, Seokjun ^{[2
]}

Lee, Seungjae ^{[2
]}

Jin, Yinhua ^{[3
]}

Kim, Taesung ^{[2
,3
]}

机构：

[1] SK Hynix, Icheon, South Korea

[2] Sungkyunkwan Univ, Sch Mech Engn, Suwon, South Korea

[3] Sungkyunkwan Univ, SKKU Adv Inst Nanotechnol SAINT, Suwon, South Korea

来源：

JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY | 2019年 / 33卷 / 07期

关键词：

CMP; Edge exclusion; Pad rebound effect; Retainer ring; Step structure; Stress distribution; STRESS;

D O I：

10.1007/s12206-019-0634-1

中图分类号：

TH [机械、仪表工业];

学科分类号：

0802 ;

摘要：

A retainer ring structure was investigated to improve non-uniformity in a chemical mechanical planarization (CMP) process. During the CMP process, the stress distribution on the wafer affects the CMP performance in terms of material removal rate (MRR) and within-wafer non-uniformity (WIWNU). The non-uniformity is related to edge exclusion and affects the process yield. For this purpose, the stress distribution between pad and wafer was calculated via the finite-element method (FEM) and compared with the experimental results of a 300 mm wafer polishing test. The retainer ring with a step structure exhibited an improved stress distribution along the wafer surface. Consequently, the non-uniformity was improved by 16.6 %. These results can be used to optimize CMP processes (in particular, CMP retainer ring structures) and determine adequate process conditions.

引用

页码：3391 / 3395

页数：5

共 9 条

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Jinwoo Park
Seokjun Hong
Seungjae Lee
Yinhua Jin
Taesung Kim
Journal of Mechanical Science and Technology, 2019, 33 : 3391 - 3395
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