Device level 3D integration technologies for high performance/reliability modules

被引：0
|
作者：
Houston, Paul [1 ]
Lewis, Brian [1 ]
Pathammavong, Keck [1 ]
Sparks, Tim [1 ]
Baldwin, Daniel F. [1 ]
机构：
[1] ENGENT, Inc., Enabling Next Generation Technologies, 3140 Northwoods Parkway, Norcross, GA 30071, United States
来源：
Advancing Microelectronics | 2010年 / 37卷 / 06期
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页码：12 / 18
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