Packaging of a MEMS based safety and arming device

被引：0
|
作者：
Deeds, Michael [1 ]
Sandborn, Peter [1 ]
Swaminathan, Rajesh [1 ]
机构：
[1] Indian Head Naval Surface Warfare, Cent
来源：
Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference | 2000年 / 1卷
关键词：
Electronics industry - Electronics packaging - Environmental testing - Failure analysis - Integrated circuit manufacture - Integrated circuit testing - Micromachining - Ordnance;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
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页码：107 / 112
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