Packaging of a MEMS based safety and arming device

被引:0
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作者
Deeds, Michael [1 ]
Sandborn, Peter [1 ]
Swaminathan, Rajesh [1 ]
机构
[1] Indian Head Naval Surface Warfare, Cent
关键词
Electronics industry - Electronics packaging - Environmental testing - Failure analysis - Integrated circuit manufacture - Integrated circuit testing - Micromachining - Ordnance;
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页码:107 / 112
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