Low cycle fatigue lives of Sn-37Pb and Sn-3.5Ag solders at low temperatures

被引：5
|
作者：
Hiyoshi, Noritake [1 ]
Katoh, Akihisa [2 ]
Sakane, Masao [3 ]
Tsukada, Yutaka [4 ]
机构：
[1] Dept. of Mech. Eng., Ishikawa National College of Tech., Kahoku-gun, Ishikawa 929-0392, Japan
[2] Ishikawa National College of Tech., Kahoku-gun, Ishikawa 929-0392, Japan
[3] Dept of Mech. Eng., Ritsumeikan Univ., Noji-higashi, Kusats 525-8577, Japan
[4] KYOCERA SLC Technologies Corporation, Ichimiyake, Yasu 520-2362, Japan
来源：
Zairyo/Journal of the Society of Materials Science, Japan | 2009年 / 58卷 / 02期
关键词：
Lead alloys - Stress-strain curves - Tin alloys - Fatigue testing - Low-cycle fatigue - Silver alloys - Binary alloys - Temperature - Strain energy;
D O I：
10.2472/jsms.58.155
中图分类号：
学科分类号：
摘要：
This paper describes low cycle fatigue lives of Sn-37Pb and Sn-3.5Ag solders at low temperatures. Push-pull low cycle fatigue tests were carried out at 253K and 273K to study the temperature effect on low cycle fatigue life. Plastic strain range was a suitable parameter for correlating the low cycle fatigue lives for the Sn-37Pb solder at the four temperatures but it was not for the Sn-3.5Ag solder. Strain energy parameter which is defined as the product of strain and stress ranges was a suitable parameter for the Sn-3.5Ag solder. Application of universal slope method was also discussed for predicting the low cycle fatigue lives of Sn-37Pb and Sn-3.5Ag solders. © 2009 The Society of Materials Science, Japan.
引用
收藏
页码：155 / 161
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