共 50 条
- [2] Lasers in advanced IC packaging applications [J]. 2007 9TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS 1 AND 2, 2007, : 396 - 399
- [3] LASER APPLICATIONS IN ADVANCED CHIP PACKAGING [J]. LASER APPLICATIONS IN MICROELECTRONIC AND OPTOELECTRONIC MANUFACTURING (LAMOM) XXI, 2016, 9735
- [5] The bifurcation of advanced IC packaging [J]. Advancing Microelectronics, 2020, 47 (01): : 6 - 8
- [6] NEW ENABLING LASER APPLICATIONS IN ADVANCED CHIP PACKAGING [J]. 2017 CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE (CSTIC 2017), 2017,
- [9] Advanced IC packaging design optimization [J]. PAN PACIFIC MICROELECTRONICS SYMPOSIUM, 2001, PROCEEDINGS, 2001, : 459 - 463