共 50 条
- [31] Advanced packaging for GHz switching applications [J]. 52ND ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2002 PROCEEDINGS, 2002, : 634 - 640
- [32] PVD SYSTEMS FOR ADVANCED PACKAGING APPLICATIONS [J]. 2018 CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE (CSTIC), 2018,
- [33] Laser applications to IC defect correction [J]. LASER APPLICATIONS IN MICROELECTRONIC AND OPTOELECTRONIC MANUFACTURING III, 1998, 3274 : 79 - 89
- [36] Advanced packaging of chiplets for future computing needs [J]. NATURE ELECTRONICS, 2024, 7 (06): : 425 - 427
- [37] D.A.P.S.A. sees a bright future for corrugated packaging [J]. Metsa-Serla News, 1999, (03): : 17 - 20
- [38] Laser processing for microelectronics packaging applications [J]. 1999 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, PROCEEDINGS, 1999, 3906 : 586 - 591
- [39] Laser applications in integrated circuit packaging [J]. PHOTON PROCESSING IN MICROELECTRONICS AND PHOTONICS, 2002, 4637 : 581 - 591