NEW ENABLING LASER APPLICATIONS IN ADVANCED CHIP PACKAGING

Laser processing is playing an increasing role in advanced packaging. Miniaturization is an obvious driver. As features shrink lasers can play to their core strength of creating intricate features with low damage to surrounding material. But quality is not everything and overshooting the quality goal can mean the process gets more expensive than necessary. The cost of ownership or cost per part has to work out, too. The following laser-based applications have been shown to be offer a cost advantage while simultaneously offering very high quality. They serve as examples of how advances in laser technology are helping to reduce feature size, improve quality and lower cost.