CHIP CARRIER PACKAGING APPLICATIONS

被引：1
|
作者：
BAUER, JA
机构：
来源：
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1980年 / 3卷 / 01期
关键词：
D O I：
10.1109/TCHMT.1980.1135592
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
引用
收藏
页码：120 / 125
页数：6
相关论文
共 50 条
  • [1] HERMETIC CHIP CARRIER PACKAGING
    REISS, EM
    GLICKSMAN, R
    [J]. SOLID STATE TECHNOLOGY, 1981, 24 (04) : 199 - 203
  • [2] CHIP CARRIER APPLICATIONS
    KATRONGE, GA
    NORTHOVER, G
    [J]. IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1981, 4 (02): : 192 - 195
  • [3] Study peeling strength of tape carrier packaging and chip scale packaging
    Yen, Yu-Tang
    Lin, Yu-Cheng
    [J]. SENSORS AND ACTUATORS A-PHYSICAL, 2007, 139 (1-2) : 330 - 336
  • [4] Applications of electrochemistry to chip packaging, an overview
    Kovac, Z
    [J]. ELECTROCHEMICAL TECHNOLOGY APPLICATIONS IN ELECTRONICS III, 2000, 99 (34): : 3 - 10
  • [5] LASER APPLICATIONS IN ADVANCED CHIP PACKAGING
    Mueller, Dirk
    Held, Andrew
    Paetzel, Rainer
    Clark, Dave
    van Nunen, Joris
    [J]. LASER APPLICATIONS IN MICROELECTRONIC AND OPTOELECTRONIC MANUFACTURING (LAMOM) XXI, 2016, 9735
  • [6] Integrating chip carrier packaging technology into avionic systems
    Banas, EC
    Chappall, CD
    [J]. PROCEEDINGS OF THE IEEE 1998 NATIONAL AEROSPACE AND ELECTRONICS CONFERENCE, 1998, : 271 - 278
  • [7] Flip chip chip scale packaging: Transfering the flip chip density requirements from the motherboard to the chip carrier
    Aday, JG
    Koehler, C
    Tessier, T
    Carpenter, B
    Matsuda, Y
    Estes, C
    [J]. 1998 INTERNATIONAL CONFERENCE ON MULTICHIP MODULES AND HIGH DENSITY PACKAGING, PROCEEDINGS, 1998, : 229 - 235
  • [8] UWB Antenna on Chip Packaging for BAN Applications
    Clauzier, Olivier
    Bones, Serge
    Delaveaud, Christophe
    [J]. 2014 8TH EUROPEAN CONFERENCE ON ANTENNAS AND PROPAGATION (EUCAP), 2014, : 2375 - 2379
  • [9] Flip chip technologies and their applications in MEMS packaging
    Wang, HY
    Bai, YL
    [J]. INTERNATIONAL JOURNAL OF NONLINEAR SCIENCES AND NUMERICAL SIMULATION, 2002, 3 (3-4) : 433 - 436
  • [10] NEW ENABLING LASER APPLICATIONS IN ADVANCED CHIP PACKAGING
    Mueller, Dirk
    Kennedy, John
    Toennies, Dietrich
    Paetzel, Rainer
    [J]. 2017 CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE (CSTIC 2017), 2017,
12345