CHIP CARRIER PACKAGING APPLICATIONS

被引：1
|
作者：
BAUER, JA
机构：
来源：
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1980年 / 3卷 / 01期
关键词：
D O I：
10.1109/TCHMT.1980.1135592
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
引用
收藏
页码：120 / 125
页数：6
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