Chip-level vacuum package and test of resonant MEMS electric field sensor

被引：0
|
作者：
State Key Laboratory of Transducer Technology, Institute of Electronics, Chinese Academy of Sciences, Beijing [1 ]
100190, China
不详 [2 ]
100049, China
不详 [3 ]
100871, China
不详 [4 ]
100084, China
机构：
来源：
Dianzi Yu Xinxi Xuebao | / 9卷 / 2282-2286期
关键词：
Microsensors - Mechanics - Electric fields - MEMS;
D O I：
10.11999/JEIT150105
中图分类号：
学科分类号：
摘要：
In order to improve the Q (Quality factor) value and SNR (Signal to Noise Ratio) and reduce the driving voltage, chip-level vacuum package of Micro-Electro-Mechanical Systems (MEMS) based resonant miniature electric field sensor is realized. By way of a novel fusion bonding process with nanogetter added, the package cap is successfully bonded with the base substrate in very low pressure. The experimental results show that the Q-value of the sensor increases 500 times to 30727.4 and the driving voltage reduces to 100 mV +60 mVp-p which decreases to 1/200 and 1/16 respectively compared to air pressure. ©, 2015, Science Press. All right reserved.
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