Chip-level vacuum package and test of resonant MEMS electric field sensor

被引：0
|
作者：
State Key Laboratory of Transducer Technology, Institute of Electronics, Chinese Academy of Sciences, Beijing [1 ]
100190, China
不详 [2 ]
100049, China
不详 [3 ]
100871, China
不详 [4 ]
100084, China
机构：
来源：
Dianzi Yu Xinxi Xuebao | / 9卷 / 2282-2286期
关键词：
Microsensors - Mechanics - Electric fields - MEMS;
D O I：
10.11999/JEIT150105
中图分类号：
学科分类号：
摘要：
In order to improve the Q (Quality factor) value and SNR (Signal to Noise Ratio) and reduce the driving voltage, chip-level vacuum package of Micro-Electro-Mechanical Systems (MEMS) based resonant miniature electric field sensor is realized. By way of a novel fusion bonding process with nanogetter added, the package cap is successfully bonded with the base substrate in very low pressure. The experimental results show that the Q-value of the sensor increases 500 times to 30727.4 and the driving voltage reduces to 100 mV +60 mVp-p which decreases to 1/200 and 1/16 respectively compared to air pressure. ©, 2015, Science Press. All right reserved.
引用
收藏
相关论文
共 50 条
  • [41] Effect of oxygen content on reliability of Au-20Sn solder joints for the chip-level package
    Liujue Wang
    Songbai Xue
    Han Liu
    Jianhao Wang
    Journal of Materials Science: Materials in Electronics, 2020, 31 : 1411 - 1420
  • [42] Chip-level solid state optical waveguide chemical sensor for detecting and measuring hydrocarbons
    Klainer, SM
    Coulter, SL
    Arrasate, ME
    Saini, DP
    ADVANCED TECHNOLOGIES FOR ENVIRONMENTAL MONITORING AND REMEDIATION, 1996, 2835 : 108 - 118
  • [43] RESEARCH AND DEVELOPMENT ON MEMS BASED ELECTRIC FIELD SENSOR
    Xia, Shanhong
    Lei, Hucheng
    Liu, Jun
    Peng, Simin
    Peng, Chunrong
    Yang, Pengfei
    Wen, Xiaolong
    Chu, Zhaozhi
    2021 21ST INTERNATIONAL CONFERENCE ON SOLID-STATE SENSORS, ACTUATORS AND MICROSYSTEMS (TRANSDUCERS), 2021, : 505 - 508
  • [44] A high thermal resistance MEMS-based Pirani vacuum sensor chip
    Dams, Florian
    Schreiner, Rupert
    SMART SENSORS, ACTUATORS, AND MEMS VI, 2013, 8763
  • [45] Enhanced Sensitivity and Stability of a Novel Resonant MEMS Electric Field Sensor Based on Closed-Loop Feedback
    Liu, Xiangming
    Wang, Zilong
    Wu, Zhengwei
    Gao, Yahao
    Peng, Simin
    Ren, Ren
    Zheng, Fengjie
    Lv, Yao
    Yang, Pengfei
    Wen, Xiaolong
    Xia, Shanhong
    Peng, Chunrong
    IEEE SENSORS JOURNAL, 2021, 21 (20) : 22536 - 22543
  • [46] Fabrication and Characterization of a Novel Wafer-level Chip Scale Package for MEMS Devices
    Cao, Yuhan
    Luo, Le
    2009 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2009), 2009, : 5 - 8
  • [47] Modelling of resonant MEMS magnetic field sensor with electromagnetic induction sensing
    Liu, Song
    Xu, Huaying
    Xu, Dehui
    Xiong, Bin
    SOLID-STATE ELECTRONICS, 2017, 132 : 91 - 98
  • [48] A self-resonant MEMS-based electrostatic field sensor
    Lundberg, Kent H.
    Shafran, John S.
    Kuang, Jinbo
    Judy, Mike
    Denison, Timothy A.
    2006 AMERICAN CONTROL CONFERENCE, VOLS 1-12, 2006, 1-12 : 1221 - +
  • [49] A CHIP-LEVEL TRANSIENT ELECTRO-THERMAL FIELD SIMULATOR WITH GATE CAPACITANCE AND MATRIX EXPONENTIAL
    Mei, Qinggao
    Wong, Ngai
    Chen, Quan
    2014 12TH IEEE INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED CIRCUIT TECHNOLOGY (ICSICT), 2014,
  • [50] A chip-level oven-controlled system used to improve accuracy of silicon piezoresistive pressure sensor
    Liu, Zhenyu
    Du, Lidong
    Zhao, Zhan
    Liu, Jihang
    Wu, Pang
    Fang, Zhen
    MEASUREMENT, 2019, 143 : 1 - 10
12345