Enhanced performance of GaN-based thin-film flip-chip LEDs with reflective current blocking layers

被引:0
|
作者
Liu, Taoming [1 ]
Deng, Youcai [1 ]
Liu, Shibiao [1 ]
Zhang, Zhening [1 ]
Su, Yuhan [1 ,2 ]
Chen, Guolong [1 ]
Kuo, Hao-Chung [3 ]
Lu, Yijun [1 ,2 ]
Chen, Zhong [1 ,2 ]
Wu, Tingzhu [1 ,2 ]
机构
[1] Fujian Engineering Research Center for Solid-State Lighting, Department of Electronic Science, Xiamen University, Xiamen,361005, China
[2] National Integrated Circuit Industry and Education Integration Innovation Platform, Department of Electronic Science, Xiamen University, Xiamen,361005, China
[3] National Chiao Tung University, Institute of Electro-Optical Engineering, Hsinchu,30010, Taiwan
基金
中国国家自然科学基金;
关键词
Distributed Bragg reflectors - Flip chip devices - Gallium alloys - III-V semiconductors - Light emitting diodes - Quantum efficiency - Silicon wafers - Wide band gap semiconductors;
D O I
10.1364/OE.537508
中图分类号
学科分类号
摘要
To further enhance the performance of GaN-based thin-film flip-chip light-emitting diodes (TFFC-LEDs), we designed and fabricated two sets of high-power blue chips with conventional and reflective current-blocking layers (CBL) The conventional CBL is composed of SiO2, whereas the reflective CBL consists of SiO2 and a distributed Bragg reflector (DBR). We systematically characterized their optoelectronic performance. The results indicate that at an injection current of 350 mA, the light output power (LOP) and external quantum efficiency (EQE) of the TFFC-LEDs with a reflective CBL increased by 4.9% and 5.7%, respectively, compared to the chips with a conventional CBL. The TFCalc simulation results indicate that the reflectivity of the reflective CBL reached 99.15%. The TracePro simulation results demonstrate that the reflective CBL can effectively enhance the light-extraction performance of the chip. We believe that the reflective CBL structure provides significant guidance for the fabrication of high-efficiency LEDs. © 2024 Optica Publishing Group under the terms of the Optica Open Access Publishing Agreement.
引用
收藏
页码:36918 / 36926
相关论文
共 50 条
  • [21] Enhanced Light Output of GaN-Based Thin-Film Flip-Chip Light-Emitting Diodes by surface texturing using laser ablation and chemical etching
    Lin, Tseng-Hsing
    Wang, Shui-Jinn
    Tu, Yung-Chun
    Hung, Chien-Hsiung
    You, Zong-Sian
    Chin, Yu-Hsueh
    2015 73RD ANNUAL DEVICE RESEARCH CONFERENCE (DRC), 2015, : 123 - 124
  • [22] Origins of Inhomogeneous Light Emission From GaN-Based Flip-Chip Green Micro-LEDs
    Guo, Weijie
    Su, Changwen
    Lu, Hao
    Peng, Zhangbao
    Ke, Zhijie
    Lu, Yijun
    Wu, Tingzhu
    Lin, Yue
    Chen, Zhong
    IEEE ELECTRON DEVICE LETTERS, 2019, 40 (07) : 1132 - 1135
  • [23] Performance of InGaN-Based Thin-Film LEDs With Flip-Chip Configuration and Concavely Patterned Surface Fabricated on Electroplating Metallic Substrate
    Hu, Xiao-Long
    Qi, Zhao-Yi
    Wang, Hong
    Zhang, Xi-Chun
    IEEE PHOTONICS JOURNAL, 2016, 8 (01):
  • [24] GaN-based flip-chip LEDs with highly reflective ITO/DBR p-type and via hole-based n-type contacts for enhanced current spreading and light extraction
    Zhou, Shengjun
    Zheng, Chenju
    Lv, Jiajiang
    Gao, Yilin
    Wang, Ruiqing
    Liu, Sheng
    OPTICS AND LASER TECHNOLOGY, 2017, 92 : 95 - 100
  • [25] Improving the External Quantum Efficiency of High-Power GaN-Based Flip-Chip LEDs by Using Sidewall Composite Reflective Micro Structure
    Xu, Liang
    Fan, Kaiping
    Sun, Huiqing
    Guo, Zhiyou
    MICROMACHINES, 2021, 12 (09)
  • [26] GaN-Based Power Flip-Chip LEDs With an Internal ESD Protection Diode on Cu Sub-Mount
    Sun, Y. X.
    Chen, W. S.
    Hung, S. C.
    Lam, K. T.
    Liu, C. H.
    Chang, Shoou-Jinn
    IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2010, 33 (02): : 433 - 437
  • [27] Techniques to reduce thermal resistance in flip-chip GaN-based VCSELs
    Mishkat-Ul-Masabih, Saadat
    Leonard, John
    Cohen, Daniel
    Nakamura, Shuji
    Feezell, Daniel
    PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE, 2017, 214 (08):
  • [28] Impact of roughening density on the light extraction efficiency of thin-film flip-chip ultraviolet LEDs grown on SiC
    Saifaddin, Burhan K.
    Iza, Michael
    Foronda, Humberto
    Almogbel, Abdullah
    Zollner, Christian J.
    Wu, Feng
    Alyamani, Ahmed
    Albadri, Abdulrahman
    Nakamura, Shuji
    DenBaars, Steven P.
    Speck, James S.
    OPTICS EXPRESS, 2019, 27 (16): : A1074 - A1083
  • [29] W-band flip-chip VCO in thin-film environment
    Schmückle, FJ
    Lenk, F
    Hutter, M
    Klein, M
    Oppermann, H
    Engelmann, G
    Töpper, M
    Riepe, K
    Heinrich, W
    2005 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM, VOLS 1-4, 2005, : 1007 - 1010
  • [30] Nitride-based flip-chip LEDs with transparent ohmic contacts and reflective mirrors
    Chang, S. J.
    Chen, W. S.
    Lin, Y. C.
    Chang, C. S.
    Ko, T. K.
    Hsu, Y. P.
    Shen, C. F.
    Tsai, J. M.
    Shei, S. C.
    IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2006, 29 (03): : 403 - 408