High-Speed Signal Optimization at Differential VIAs in Multilayer Printed Circuit Boards

被引：0

作者：

Xu, Wen-Jie ^{[1
]}

Xin, Dong-Jin ^{[1
,2
]}

Yang, Lei ^{[1
,2
]}

Zhou, Yong-Kang ^{[1
]}

Wang, Dong ^{[1
,2
]}

Li, Wei-Xin ^{[1
,2
]}

机构：

[1] Univ Jinan, Sch Informat Sci & Engn, Jinan 250022, Peoples R China

[2] Univ Jinan, Sch Informat Sci & Engn, Shandong Prov Key Lab Ubiquitous Intelligent Comp, Jinan 250022, Peoples R China

来源：

ELECTRONICS | 2024年 / 13卷 / 17期

关键词：

signal integrity (SI); PCB interconnection optimization; resonance; differential VIA hole design; TRANSMISSION WAVE-FORM; EYE DIAGRAM; SILICON; STUBS;

D O I：

10.3390/electronics13173377

中图分类号：

TP [自动化技术、计算机技术];

学科分类号：

0812 ;

摘要：

The number of Printed Circuit Board (PCB) layers is continually increasing with the increase in data transmission rates, and the Signal Integrity (SI) of high-speed digital systems cannot be ignored. Introducing Vertical Interconnect Accesses (VIAs) in PCBs can realize the electrical connection between the top layer and the inner layers, however, VIAs represent one of the most important reasons for discontinuity between the PCBs and package. In this paper, a new optimization scheme for a differential VIA stub is proposed, with 3D full-wave numerical simulation used for modeling and simulation. Results show that this scheme optimizes the return loss and insertion loss while making the signal eye diagram more ideal, which can improve the transmission effect of high-speed signals.

引用

页数：11

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