共 50 条
- [4] OXIDE COATINGS FOR BONDING MULTILAYER PRINTED-CIRCUIT BOARDS [J]. TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING, 1987, 65 : A8 - A9
- [5] ELECTROLESS COPPER PLATING OF MULTILAYER PRINTED-CIRCUIT BOARDS [J]. PLATING AND SURFACE FINISHING, 1978, 65 (07): : 36 - 41
- [6] EFFECTS OF BAKEOUTS ON CHARACTERISTICS OF MULTILAYER PRINTED-CIRCUIT BOARDS [J]. PLATING AND SURFACE FINISHING, 1982, 69 (03): : 68 - 72
- [9] THE PRODUCTION OF MULTILAYER CERAMIC SUPPORTS AND PRINTED-CIRCUIT BOARDS [J]. WERKSTATTSTECHNIK ZEITSCHRIFT FUR INDUSTRIELLE FERTIGUNG, 1982, 72 (02): : 102 - 103
- [10] DIFFERENTIAL SCANNING CALORIMETRY OF PREPREGS FOR MULTILAYER PRINTED-CIRCUIT BOARDS [J]. SIEMENS FORSCHUNGS-UND ENTWICKLUNGSBERICHTE-SIEMENS RESEARCH AND DEVELOPMENT REPORTS, 1987, 16 (03): : 101 - 104