Investigation on high-aspect-ratio silicon carbide ceramic microchannel by using waterjet-assisted laser micromachining

被引:1
|
作者
Han, Jinjin [1 ]
Tong, Linpeng [1 ]
He, Bin [1 ]
Kong, Linglei [1 ]
Li, Qilin [1 ]
Wang, Denglong [1 ]
Ding, Kai [1 ]
Lei, Weining [1 ]
机构
[1] Jiangsu Univ Technol, Coll Mech Engn, Zhongwu Ave 1801, Changzhou 213001, Peoples R China
基金
中国国家自然科学基金;
关键词
Waterjet-assisted machining; Direct laser machining; High-aspect-ratio microchannels; Sidewall surface quality; ABLATION; TEMPERATURE; ENHANCEMENT; UNDERWATER; EVOLUTION; JET;
D O I
10.1007/s00170-024-14354-5
中图分类号
TP [自动化技术、计算机技术];
学科分类号
0812 ;
摘要
The challenging machinability of silicon carbide (SiC) ceramic, due to its hardness and brittleness, has traditionally constrained its machined quality and the creation of functional surfaces. Compared to direct laser machining (DLM), waterjet-assisted laser micromachining (WJALM) is an alternative technique for SiC ceramic that is capable of reducing thermal-induced damages. In this paper, high-aspect-ratio (HAR) microchannels are fabricated on silicon carbide ceramic by WJALM, and its effectiveness is verified through comparative experiments with DLM. The effects of the parametric combination of waterjet and laser parameters on machining responses of geometric structural features and sidewall surface quality are investigated by controlled variable experiments. The results revealed that HAR microchannels with almost no recast layers could be obtained when the SiC workpiece was fabricated by a nanosecond laser under the flowing water medium layer, and higher average laser power of 27 W, lower scanning speed of 600 m/s, and medium waterjet velocity of 12/16 m/s contributed to larger aspect ratio, more ablation area and superior sidewall quality of HAR microchannels.
引用
收藏
页码:4127 / 4140
页数:14
相关论文
共 50 条
  • [1] Experimental investigation on large-aspect-ratio zirconia ceramic microchannels by waterjet-assisted laser processing
    Qiu, Qingqing
    Han, Jinjin
    Khan, Aqib Mashood
    Ma, Rui
    He, Bin
    Kong, Linglei
    Li, Qilin
    Ding, Kai
    Ahmad, Wasim
    Lei, Weining
    ALEXANDRIA ENGINEERING JOURNAL, 2025, 111 : 456 - 467
  • [2] A high-aspect-ratio comb actuator using UV-LIGA surface micromachining and (110) silicon bulk micromachining
    Kim, SH
    Lee, SH
    Kim, YK
    JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2002, 12 (02) : 128 - 135
  • [3] High-aspect-ratio micromachining of fluoropolymers using focused ion beam
    Matsui, Yoshinori
    Miyoshi, Nozomi
    Oshima, Akihiro
    Seki, Shu
    Washio, Masakazu
    Tagawa, Seiichi
    ION-BEAM-BASED NANOFABRICATION, 2007, 1020 : 61 - 66
  • [4] Laser micromachining of high-aspect-ratio metallic grooves for application to microthermal devices
    Oh, Kwang H.
    Lee, M. K.
    Jeong, S. H.
    JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2006, 16 (10) : 1958 - 1966
  • [5] Electrochemical micromachining using vibratile tungsten wire for high-aspect-ratio microstructures
    Wang, K.
    SURFACE ENGINEERING AND APPLIED ELECTROCHEMISTRY, 2010, 46 (05): : 395 - 399
  • [6] Electrochemical micromachining using vibratile tungsten wire for high-aspect-ratio microstructures
    K. Wang
    Surface Engineering and Applied Electrochemistry, 2010, 46 : 395 - 399
  • [7] A boron etch-stop assisted lateral silicon etching process for improved high-aspect-ratio silicon micromachining and its applications
    Hsieh, J
    Fang, WL
    JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2002, 12 (05) : 574 - 581
  • [8] Fabrication of high-aspect-ratio microstructures using excimer laser
    Tseng, AA
    Chen, YT
    Ma, KJ
    OPTICS AND LASERS IN ENGINEERING, 2004, 41 (06) : 827 - 847
  • [9] Simulation and optimization of a micromachined gyroscope using high-aspect-ratio micromachining fabrication process
    Ruan, AW
    Tse, MS
    Chong, GY
    DESIGN, CHARACTERIZATION, AND PACKAGING FOR MEMS AND MICROELECTRONICS II, 2001, 4593 : 176 - 185
  • [10] A triple-layer protection process for high-aspect-ratio silicon micromachining by DRIE of SOI substrates
    Ma, Zhibo
    Jiang, Chengyu
    Yuan, Weizheng
    JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2012, 22 (05)