Investigation on high-aspect-ratio silicon carbide ceramic microchannel by using waterjet-assisted laser micromachining

被引:1
|
作者
Han, Jinjin [1 ]
Tong, Linpeng [1 ]
He, Bin [1 ]
Kong, Linglei [1 ]
Li, Qilin [1 ]
Wang, Denglong [1 ]
Ding, Kai [1 ]
Lei, Weining [1 ]
机构
[1] Jiangsu Univ Technol, Coll Mech Engn, Zhongwu Ave 1801, Changzhou 213001, Peoples R China
基金
中国国家自然科学基金;
关键词
Waterjet-assisted machining; Direct laser machining; High-aspect-ratio microchannels; Sidewall surface quality; ABLATION; TEMPERATURE; ENHANCEMENT; UNDERWATER; EVOLUTION; JET;
D O I
10.1007/s00170-024-14354-5
中图分类号
TP [自动化技术、计算机技术];
学科分类号
0812 ;
摘要
The challenging machinability of silicon carbide (SiC) ceramic, due to its hardness and brittleness, has traditionally constrained its machined quality and the creation of functional surfaces. Compared to direct laser machining (DLM), waterjet-assisted laser micromachining (WJALM) is an alternative technique for SiC ceramic that is capable of reducing thermal-induced damages. In this paper, high-aspect-ratio (HAR) microchannels are fabricated on silicon carbide ceramic by WJALM, and its effectiveness is verified through comparative experiments with DLM. The effects of the parametric combination of waterjet and laser parameters on machining responses of geometric structural features and sidewall surface quality are investigated by controlled variable experiments. The results revealed that HAR microchannels with almost no recast layers could be obtained when the SiC workpiece was fabricated by a nanosecond laser under the flowing water medium layer, and higher average laser power of 27 W, lower scanning speed of 600 m/s, and medium waterjet velocity of 12/16 m/s contributed to larger aspect ratio, more ablation area and superior sidewall quality of HAR microchannels.
引用
收藏
页码:4127 / 4140
页数:14
相关论文
共 50 条
  • [21] Advances in High-Aspect-Ratio Deep Reactive Ion Etching of 4H-Silicon Carbide Wafers
    Li, Ningxin
    Liu, Zhenming
    Lotfi, Ardalan
    Jiang, Xinyu
    Long, Emma
    Sahasrabudhe, Shubham S.
    Bolton, Chris
    Ashraf, Huma
    Ayazi, Farrokh
    JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2024, 33 (06) : 776 - 784
  • [22] Parallel fabrication of high-aspect-ratio all-silicon grooves using femtosecond laser irradiation and wet etching
    Li, Yanna
    Chen, Tao
    Pan, An
    Li, Cunxia
    Tang, Litie
    JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2015, 25 (11)
  • [23] Fabrication of high-aspect-ratio grooves in silicon using femtosecond laser irradiation and oxygen-dependent acid etching
    Pan, An
    Si, Jinhai
    Chen, Tao
    Ma, Yuncan
    Chen, Feng
    Hou, Xun
    OPTICS EXPRESS, 2013, 21 (14): : 16657 - 16662
  • [24] High-Aspect-Ratio Silicon Nanostructures on N-type Silicon Wafer Using Metal-Assisted Chemical Etching (MACE) Technique
    Razak, Nurul Huda Abdul
    Amin, Nowshad
    Kiong, Tiong Sieh
    Sopian, Kamaruzzaman
    Akhtaruzzaman, Md
    2021 IEEE 48TH PHOTOVOLTAIC SPECIALISTS CONFERENCE (PVSC), 2021, : 2596 - 2599
  • [25] Numerical and Experimental Investigation of Thermomechanical Deformation in High-Aspect-Ratio Electroplated Through-Silicon Vias
    Dixit, Pradeep
    Yaofeng, Sun
    Miao, Jianmin
    Pang, John H. L.
    Chatterjee, Ritwik
    Tummalaa, Rao R.
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2008, 155 (12) : H981 - H986
  • [26] Fabrication and probabilistic fracture strength prediction of high-aspect-ratio single crystal silicon carbide microspecimens with stress concentration
    Nemeth, N. N.
    Evans, L. J.
    Jadaan, O. M.
    Sharpe, W. N.
    Beheim, G. M.
    Trapp, M. A.
    THIN SOLID FILMS, 2007, 515 (06) : 3283 - 3290
  • [27] Fabrication of High-aspect-ratio Nanohole Arrays on GaN Surface by Using Wet-chemical-assisted Femtosecond Laser Ablation
    Nakashima, Seisuke
    Sugioka, Koji
    Ito, Takuma
    Takai, Hiroshi
    Midorikawa, Katsumi
    JOURNAL OF LASER MICRO NANOENGINEERING, 2011, 6 (01): : 15 - 19
  • [28] High-aspect-ratio microstructures with versatile slanting angles on silicon by uniform metal-assisted chemical etching
    Li, Liyi
    Zhang, Cheng
    Tuan, Chia-Chi
    Chen, Yun
    Wong, C-P
    JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2018, 28 (05)
  • [29] Backside ultraviolet illumination enhanced metal-assisted chemical etching for high-aspect-ratio silicon microstructures
    Shi, Dachuang
    Chen, Yun
    Chen, Yanhui
    Hou, Maoxiang
    Chen, Xun
    Chen, Xin
    Gao, Jian
    He, Yunbo
    2020 21ST INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2020,
  • [30] High aspect ratio sapphire micromachining by ultraviolet laser-induced plasma-assisted ablation (LIPAA)
    Cole, Douglas F. F.
    Zednik, Ricardo J. J.
    Hof, Lucas A. A.
    INTERNATIONAL JOURNAL OF APPLIED CERAMIC TECHNOLOGY, 2023, 20 (05) : 3279 - 3286