High-aspect-ratio micromachining of fluoropolymers using focused ion beam

被引:0
|
作者
Matsui, Yoshinori [1 ]
Miyoshi, Nozomi [2 ]
Oshima, Akihiro [2 ]
Seki, Shu [1 ]
Washio, Masakazu [2 ]
Tagawa, Seiichi [1 ]
机构
[1] Osaka Univ, Inst Sci & Ind Res, 8-1 Mihogaoka, Osaka 5670047, Japan
[2] Waseda Univ, Res Inst Sci & Engn, Tokyo 1698555, Japan
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中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Poly(tetrafluoroethylene) (PTFE) microstructure with high aspect ratio (> 200) and without solid debris along the edge was fabricated with high etch rate using FIB. Evolution of PTFE by FIB is responsible for the high aspect ratio, the high etch rate, and the no solid debris. Roughness of etched surface of the PTFE increases with fluence, although edge of the etched area has good profiles. The etch mechanism seems to be complicated.
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页码:61 / 66
页数:6
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