A Novel 1T-DRAM Fabricated With 22 nm FD-SOI Technology

被引:1
|
作者
Xie, H. [1 ]
Zhang, W. [1 ]
Zhou, P. [2 ]
Cristoloveanu, S. [3 ]
Xu, Y. [4 ,5 ]
Liu, F. Y. [6 ]
Wan, J. [1 ]
机构
[1] Fudan Univ, Sch Informat Sci & Technol, Shanghai 200433, Peoples R China
[2] Fudan Univ, Sch Microelect, State Key Lab ASIC & Syst, Shanghai 200433, Peoples R China
[3] Univ Grenoble Alpes, CNRS, IMEP, Grenoble Inst Technol,LAHC, F-38360 Grenoble, France
[4] Guangdong Greater Bay Area Inst Integrated Circuit, Guangzhou 510535, Peoples R China
[5] Nanjing Univ Posts & Telecommun, Coll Integrated Circuit Sci & Engn, Nanjing 210003, Peoples R China
[6] Chinese Acad Sci, Inst Microelect, Beijing 100029, Peoples R China
关键词
1T-DRAM; IS-DRAM; in-situ sensing; non-destructive reading; FD-SOI; 22nm technology; RANDOM-ACCESS MEMORY; DRAM CELL; 1T DRAM;
D O I
10.1109/LED.2024.3368522
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A novel single-transistor dynamic random access memory (1T-DRAM) named IS-DRAM (in-situ sensing DRAM) which combines non-destructive reading with compact footprint is experimentally demonstrated with advanced 22nm fully depleted silicon-on-insulator (FD-SOI) technology. Unlike conventional 1T-DRAM using floating-body effect in SOI, the IS-DRAM stores charge in the substrate beneath the buried oxide (BOX). The stored charge modulates the drain current of the top Si transistor through interface coupling effect, and thus the state of the memory is "in-situ" read out. A buried accessing diode is formed in the substrate in order to write and erase the stored charge. Excellent writing time and retention reaching 10ns and 94ms at 85 degrees respectively have been measured in IS-DRAM with 26 nm gate length.
引用
收藏
页码:558 / 561
页数:4
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