BBCube 3D Integration Technology Utilizes WOW and COW Hybrid Processes

被引：0
|
作者：
Ohba T. [1 ]
Chujo N. [1 ]
Ryoson H. [1 ]
Funaki T. [1 ]
机构：
[1] Tokyo Institute of Technology, Institute of Innovative Research (IIR), 4259 Nagatsuta, Midori-ku, Yokohama
来源：
Journal of Japan Institute of Electronics Packaging | 2023年 / 26卷 / 04期
关键词：
D O I：
10.5104/jiep.26.348
中图分类号：
学科分类号：
摘要：
[No abstract available]
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页码：348 / 355
页数：7
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