共 50 条
- [41] Copper deposition on micropatterned electrodes from an industrial acid copper plating bath Journal of Applied Electrochemistry, 2000, 30 : 1 - 12
- [42] THE FLAME PHOTOMETRIC DETERMINATION OF LEAD AND COPPER IN PLATING BATH SOLUTIONS SPECTROCHIMICA ACTA, 1956, 8 (02): : 125 - 125
- [43] OPTIMIZATION OF AN ACID COPPER BATH FOR THROUGH-HOLE PLATING PLATING AND SURFACE FINISHING, 1986, 73 (03): : 36 - 37
- [44] WHAT ARE THE FUNCTIONS OF ALL THE CONSTITUENTS IN AN ELECTROLESS COPPER PLATING BATH PLATING AND SURFACE FINISHING, 1992, 79 (07): : 81 - 81
- [45] ACID COPPER BATH FOR THROUGH-HOLE PLATING. IBM technical disclosure bulletin, 1983, 26 (04): : 2173 - 2176
- [46] Copper plating on SUS 304 plate from acid bath MATERIALS PROCESSING TECHNOLOGIES, PTS 1 AND 2, 2011, 154-155 : 1008 - 1011
- [47] Analysis and control of copper plating bath additives and by-products CHARACTERIZATION AND METROLOGY FOR ULSI TECHNOLOGY, 2003, 683 : 514 - 518
- [49] Optimization of bath composition for hard Fe–C alloy plating Journal of Applied Electrochemistry, 1998, 28 : 855 - 862