THROWING POWER OF A DILUTE COPPER PLATING BATH AS A FUNCTION OF COMPOSITION

被引:0
|
作者
KRUGLIKOV, SS
YARLYKOV, MM
BRAUN, EV
KLOCHKOVA, MN
SAVELEV, MI
机构
来源
PROTECTION OF METALS | 1986年 / 22卷 / 05期
关键词
D O I
暂无
中图分类号
TF [冶金工业];
学科分类号
0806 ;
摘要
引用
收藏
页码:667 / 669
页数:3
相关论文
共 50 条
  • [31] Electrodeposition of Copper in Trenches From a Citrate Plating Bath
    Lizama Tzec, F. I.
    Oskam, G.
    SEMICONDUCTORS, METAL OXIDES, AND COMPOSITES: METALLIZATION AND ELECTRODEPOSITION OF THIN FILMS AND NANOSTRUCTURES, 2010, 25 (27): : 195 - 201
  • [32] PLATING POROSITY AS A FUNCTION OF THE PH OF A THIOCYANATE CYANIDE SILVER PLATING BATH
    NAPUKH, EZ
    BOCHKAREV, VA
    SOVIET ELECTROCHEMISTRY, 1985, 21 (06): : 735 - 735
  • [33] Throwing power of plating solutions with particular reference to certain zinc plating solutions.
    Braund, BK
    TRANSACTIONS OF THE FARADAY SOCIETY, 1931, 27 : 0661 - 0674
  • [34] MODEL FOR CALCULATING METAL DISTRIBUTION AND THROWING POWER OF PLATING BATHS
    TAN, TC
    PLATING AND SURFACE FINISHING, 1987, 74 (07): : 67 - 71
  • [35] ASPECTS OF THE DETERMINATION OF THE THROWING POWER OF CHROME-PLATING ELECTROLYTES
    SHULGIN, VG
    JOURNAL OF APPLIED CHEMISTRY OF THE USSR, 1990, 63 (10): : 2040 - 2047
  • [36] Throwing power of electrolytes for Cr-P alloy plating
    Nachinov, G.N.
    Pomogaev, V.M.
    Vinokurov, E.G.
    Kudryavtsev, V.N.
    Zashchita Metallov, 1992, 28 (06): : 1026 - 1028
  • [37] FACTORS INVOLVED IN THE DEVELOPMENT OF PLATING SOLUTIONS WITH HIGH THROWING POWER
    ROTHSCHILD, BF
    PLATING AND SURFACE FINISHING, 1979, 66 (05): : 70 - 74
  • [38] Toward Preeminent Throwing Power from a Novel Alkaline Copper Electronic Electroplating Bath with Composite Coordination Agents
    Li, Wei-Qing
    Jin, Lei
    Yang, Jia-Qiang
    Wang, Zhao-Yun
    Zhan, Dongping
    Yang, Fang-Zu
    Tian, Zhong-Qun
    CHEMELECTROCHEM, 2022, 9 (11)
  • [39] ELECTRODIALYSIS PERFORMANCE WHEN RECYCLING DILUTE NICKEL SOLUTIONS DIRECTLY INTO A PLATING BATH
    TISON, RP
    MIKHAIL, YM
    JOURNAL OF MEMBRANE SCIENCE, 1982, 11 (02) : 147 - 156
  • [40] Copper deposition on micropatterned electrodes from an industrial acid copper plating bath
    Goldbach, S
    Van den Bossche, B
    Daenen, T
    Deconinck, J
    Lapicque, F
    JOURNAL OF APPLIED ELECTROCHEMISTRY, 2000, 30 (01) : 1 - 12