USE OF ALUMINUM BUMPS IN MULTICHIP TECHNOLOGY

被引：0
|
作者：
SELLO, H
机构：
来源：
AMERICAN CERAMIC SOCIETY BULLETIN | 1972年 / 51卷 / 04期
关键词：
D O I：
暂无
中图分类号：
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
引用
收藏
页码：360 / &
相关论文
共 50 条
  • [41] VLSI CHIP INTERCONNECTION TECHNOLOGY USING STACKED SOLDER BUMPS
    MATSUI, N
    SASAKI, S
    OHSAKI, T
    IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1987, 10 (04): : 566 - 570
  • [42] Novel MBB technology using electroless plated Ni and In bumps
    Ohtsuka, T
    Kawakita, T
    Fujimoto, H
    Hatada, K
    1ST 1997 IEMT/IMC SYMPOSIUM, 1997, : 169 - 173
  • [43] A multichip module integration technology on silicon substrate for high frequency applications
    Mangold, T
    Gulde, P
    Neumann, G
    Russer, P
    1998 TOPICAL MEETING ON SILICON MONOLITHIC INTEGRATED CIRCUITS IN RF SYSTEMS: DIGEST OF PAPERS, 1998, : 181 - 184
  • [44] Extension of high density interconnect multichip module technology for MEMS packaging
    Butler, JT
    Bright, VM
    Saia, RJ
    Comtois, JH
    MICROMACHINED DEVICES AND COMPONENTS III, 1997, 3224 : 169 - 177
  • [45] ELECTRON-BEAM TECHNOLOGY FOR OPEN SHORT TESTING OF MULTICHIP SUBSTRATES
    GOLLADAY, SD
    WAGNER, NA
    RUDERT, JR
    SCHMIDT, RN
    IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1990, 34 (2-3) : 250 - 259
  • [46] BOND WIRELESS MULTICHIP PACKAGING TECHNOLOGY FOR HIGH-SPEED CIRCUITS
    CHEN, CL
    MAHONEY, LJ
    TSANG, DZ
    MOLVAR, KM
    IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1992, 15 (04): : 451 - 456
  • [47] The Use of Floster S Technology in Modified Ablation Casting of Aluminum Alloys
    Kaminska, J.
    Angrecki, M.
    Puzio, S.
    Hosadyna-Kondracka, M.
    Major-Gabrys, K.
    ARCHIVES OF FOUNDRY ENGINEERING, 2019, 19 (04) : 81 - 86
  • [48] Solar energy use is maturing, with bumps and bright spots
    Newman, Karen A.
    PHOTONICS SPECTRA, 2011, 45 (09) : 10 - 10
  • [49] Multichip alignment technology for 3D stack bonding and packaging
    Chen, Mingxiang
    Lü, Yaping
    Liu, Xiaogang
    Liu, Sheng
    Huazhong Keji Daxue Xuebao (Ziran Kexue Ban)/Journal of Huazhong University of Science and Technology (Natural Science Edition), 2015, 43 (02): : 1 - 5
  • [50] LOW-COST DEVELOPMENTS SURFACE FOR MULTICHIP-MODULE TECHNOLOGY
    MALINIAK, D
    ELECTRONIC DESIGN, 1992, 40 (22) : 28 - 28
12345