USE OF ALUMINUM BUMPS IN MULTICHIP TECHNOLOGY

被引：0
|
作者：
SELLO, H
机构：
来源：
AMERICAN CERAMIC SOCIETY BULLETIN | 1972年 / 51卷 / 04期
关键词：
D O I：
暂无
中图分类号：
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
引用
收藏
页码：360 / &
相关论文
共 50 条
  • [21] A TECHNOLOGY FOR OPTICAL INTERCONNECTIONS BASED ON MULTICHIP INTEGRATION
    TSANG, DZ
    SMYTHE, DL
    CHU, A
    LAMBERT, JJ
    OPTICAL ENGINEERING, 1986, 25 (10) : 1127 - 1131
  • [22] The use of laminate multichip modules for the packaging of 9-GHz digital multichip circuits
    Schwab, DJ
    Randall, B
    Zabinski, PJ
    Schaefer, TM
    Gilbert, BK
    IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2002, 25 (01): : 79 - 91
  • [23] Excimer laser microvia-technology in multichip modules
    Manirambona, B
    De Baets, J
    Vervaet, A
    APPLIED SURFACE SCIENCE, 2003, 208 : 171 - 176
  • [24] An investigation into the design flow problems in multichip module technology
    Aziz, R
    Beamish, JC
    ADVANCES IN MANUFACTURING TECHNOLOGY XII, 1998, : 17 - 22
  • [25] MULTICHIP PACKAGING TECHNOLOGY WITH LASER-PATTERNED INTERCONNECTS
    BARFKNECHT, AT
    TUCKERMAN, DB
    KASCHMITTER, JL
    MCWILLIAMS, BM
    IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1989, 12 (04): : 646 - 649
  • [26] ADVANCED ASSEMBLY METHODS - MULTICHIP MODULES AND FLIPCHIP TECHNOLOGY
    LOSCH, K
    ALLAERT, K
    SMERNOS, S
    NOVOTNY, J
    ELECTRICAL COMMUNICATION, 1993, (03): : 260 - 267
  • [27] Surface Analysis of Aluminum Bonding Pads in Flash Memory Multichip Packaging
    Son, Dong Ju
    Hong, Sang Jeen
    TRANSACTIONS ON ELECTRICAL AND ELECTRONIC MATERIALS, 2014, 15 (04) : 221 - 225
  • [28] A SILICON-BASED MULTICHIP MODULE WITH COFIRED ALUMINUM NITRIDE PACKAGE
    SUDO, T
    KIMIJIMA, S
    SHIMADA, O
    IWASE, N
    IEICE TRANSACTIONS ON COMMUNICATIONS ELECTRONICS INFORMATION AND SYSTEMS, 1991, 74 (08): : 2323 - 2330
  • [29] Two-layer, planar, superconducting multichip module technology
    Luo, WA
    Yao, HJ
    Zhang, G
    Chan, FT
    Ang, SS
    Brown, WD
    Salamo, GJ
    Cooksey, JW
    2000 HD INTERNATIONAL CONFERENCE ON HIGH-DENSITY INTERCONNECT AND SYSTEMS PACKAGING, 2000, 4217 : 226 - 231
  • [30] ROAD BUMPS - APPROPRIATE FOR USE ON PUBLIC STREETS
    不详
    ITE JOURNAL-INSTITUTE OF TRANSPORTATION ENGINEERS, 1986, 56 (11): : 18 - 21
12345