The use of laminate multichip modules for the packaging of 9-GHz digital multichip circuits

被引:5
|
作者
Schwab, DJ [1 ]
Randall, B [1 ]
Zabinski, PJ [1 ]
Schaefer, TM [1 ]
Gilbert, BK [1 ]
机构
[1] Mayo Clin & Mayo Fdn, Special Purpose Proc Dev Grp, Rochester, MN 55905 USA
来源
关键词
digital receiver; MCM-L; S-parameter measurements; transmission lines; wire bonds;
D O I
10.1109/TADVP.2002.1017689
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
An investigation of the high-frequency performance of laminate multichip module (MCM-L) technology. was undertaken with the goal of demonstrating its appropriateness for the development of digital radar receivers operating in the X band (8 to 12 GHz). A seven-chip circuit using digital components on a Gore MCM-L was successfully tested up to 9.6 GHz. An analog-to-digital converter on an MCM-L was successfully tested up to 6 GHz. An extensive characterization of the MCM-L technology using both simulations and measurements was performed to formulate a set of design guidelines for high-frequency applications. A novel dielectric-encapsulated MCM-to-MCM interconnect scheme was proposed and tested.
引用
收藏
页码:79 / 91
页数:13
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