USE OF ALUMINUM BUMPS IN MULTICHIP TECHNOLOGY

被引：0
|
作者：
SELLO, H
机构：
来源：
AMERICAN CERAMIC SOCIETY BULLETIN | 1972年 / 51卷 / 04期
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D O I：
暂无
中图分类号：
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
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页码：360 / &
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