LED PACKAGE INCLUDES IC REGULATOR

被引：0
|
作者：
SIDERIS, G
机构：
来源：
ELECTRONICS | 1973年 / 46卷 / 23期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：129 / 129
页数：1
相关论文
共 50 条
  • [41] AN AUTOMATIC DESIGN SYSTEM OF IC LOGIC PACKAGE
    KITAMURA, T
    NEC RESEARCH & DEVELOPMENT, 1969, (14): : 29 - +
  • [42] IC package solutions for high performance memory
    Solberg, V
    PAN PACIFIC MICROELECTRONICS SYMPOSIUM, 2001, PROCEEDINGS, 2001, : 128 - 135
  • [43] Deep Considerations on LED Package Technology
    Li Kunzhui
    Xu Shaohua
    Tang Yuchuang
    Weng Xiangze
    Wang Yi
    2015 12TH CHINA INTERNATIONAL FORUM ON SOLID STATE LIGHTING (SSLCHINA), 2015, : 8 - 11
  • [44] NEW EPOXY PACKAGE INCREASES IC RELIABILITY
    HNATEK, ER
    SOLID STATE TECHNOLOGY, 1972, 15 (11) : 44 - &
  • [45] Hygrothermal cracking analysis of plastic IC package
    Yang, JH
    Lee, KY
    JOURNAL OF ELECTRONIC PACKAGING, 2005, 127 (02) : 164 - 171
  • [46] High power LED package requirements
    Wall, F
    THIRD INTERNATIONAL CONFERENCE ON SOLID STATE LIGHTING, 2004, 5187 : 85 - 92
  • [47] Advanced Thermal Modeling of IC - Package Interaction
    Cao, Zhibo
    Stocchi, Matteo
    Wietstruck, Matthias
    Garbuglia, Federico
    Pincini, Diego
    Kaynak, Mehmet
    2020 IEEE RADIO AND WIRELESS SYMPOSIUM (RWS 2020), 2020, : 326 - 329
  • [48] The Optimization of the Heat Removal on the LED Package
    Lin, David T. W.
    Huang, Chung-Neng
    Chang, Chong-Ching
    ADVANCED SCIENCE LETTERS, 2011, 4 (6-7) : 2301 - 2305
  • [49] The Computer Heat Simulation of LED Package
    Huang, Zhiqin
    Huang, Lipu
    Pan, Yue
    2015 2ND INTERNATIONAL CONFERENCE ON MATERIAL ENGINEERING AND APPLICATION (ICMEA 2015), 2015, : 653 - 658
  • [50] LED Package Based on MATLAB Program
    Huang, Zhiqin
    Zheng, Xiuyun
    Liu, Fengling
    INFORMATION COMPUTING AND APPLICATIONS, PT 1, 2012, 307 : 653 - +
12345