Advanced Thermal Modeling of IC - Package Interaction

被引：0
|
作者：
Cao, Zhibo [1 ]
Stocchi, Matteo [1 ]
Wietstruck, Matthias [1 ]
Garbuglia, Federico [1 ]
Pincini, Diego [1 ]
Kaynak, Mehmet [1 ,2 ]
机构：
[1] IHP Leibniz Inst Innovat Mikroelekt, D-15236 Frankfurt, Oder, Germany
[2] Sabanci Univ, TR-34956 Istanbul, Tuzla, Turkey
来源：
2020 IEEE RADIO AND WIRELESS SYMPOSIUM (RWS 2020) | 2020年
关键词：
ANSYS; COMSOL; finite element method; thermal; convection;
D O I：
暂无
中图分类号：
TN [电子技术、通信技术];
学科分类号：
0809 ;
摘要：
A layout based finite element thermal convection model including detailed board tracing and packaging information is developed. A state-of-art 0.13-mu m SiGe BiCMOS chip with embedded poly-resistors and thermal diodes are used as experimental validations of thermal modelling results. The designated thermal model demonstrates a high accuracy of less than 1.5 Celsius deviation from experimental results. And the layout based automatic generation of model geometry drastically reduces time consumption during model development and, moreover, paves the way for modelling of packages which possess even higher complexities.
引用
收藏
页码：326 / 329
页数：4
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