The Optimization of the Heat Removal on the LED Package

The aim of this article attempts to explore the optimal design of the high power LED package related the thermal characteristics. To achieve the optimal design of the size of the slug inside the LED package is our purpose to improve the heat removal. The simplified conjugate-gradient method (SCGM) is adopted to combine with the finite element method to optimize the shape of the slug inside the LED package. The results show that the shape of the slug changing directly affects the temperature profile inside the LED. The heat generated from die of the LED can be removed more by the change of the slug. It is obvious that the proposed method is effective on thermal optimization of the LED package. This proposed method may give rise to a new insight and more innovative possibilities in the development of the new generation LED.