共 50 条
- [43] RELIABILITY EVALUATION OF FATIGUE LIFE FOR SOLDER JOINTS IN CHIP COMPONENTS CONSIDERING DISPERSION OF THE SHAPE AND THE PROPERTIES PROCEEDINGS OF THE ASME PACIFIC RIM TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC SYSTEMS, MEMS AND NEMS 2011, VOL 1, 2012, : 191 - 194
- [44] Comparison of isothermal mechanical fatigue properties of lead-free solder joints and bulk solders MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2005, 394 (1-2): : 20 - 27
- [45] Thermomechanical properties and fatigue life evaluation of SnAgCu solder joints for microelectronic power module application JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, 2020, 9 (03): : 5533 - 5541
- [46] Fatigue Properties of Lead-free Solder Joints in Electronic Packaging Assembly Investigated by Isothermal Cyclic Shear Fatigue 2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2014, : 133 - 138
- [47] Improvement of fatigue life of solder joints by thickness control of solder with wire bump technique 52ND ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2002 PROCEEDINGS, 2002, : 1469 - 1474
- [48] Numerical simulation of fatigue crack growth in microelectronics solder joints CMES-COMPUTER MODELING IN ENGINEERING & SCIENCES, 2000, 1 (01): : 107 - 110
- [49] Numerical simulation for the Thermal Fatigue of Flip Chip Solder Joints MANUFACTURING SCIENCE AND ENGINEERING, PTS 1-5, 2010, 97-101 : 3963 - +
- [50] Fatigue Performance of Doped SAC Solder Joints in BGA Assembly PROCEEDINGS OF THE NINETEENTH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM 2020), 2020, : 1035 - 1042