FATIGUE PROPERTIES OF SOLDER JOINTS

被引：0
|
作者：
WILD, RN
机构：
来源：
WELDING JOURNAL | 1972年 / 51卷 / 11期
关键词：
D O I：
暂无
中图分类号：
TF [冶金工业];
学科分类号：
0806 ;
摘要：
引用
收藏
页码：S521 / &
相关论文
共 50 条
  • [31] Fatigue life estimation of surface mount solder joints
    Xie, DJ
    Chan, YC
    Lai, JKL
    Hui, IK
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 1996, 19 (03): : 669 - 678
  • [32] Modeling and experiments on an isothermal fatigue test for solder joints
    Ridout, S
    Dusek, M
    Bailey, C
    Hunt, C
    Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005, : 478 - 482
  • [33] Effect of microstructural variability on fatigue simulations of solder joints
    Rebosolan, M.
    van Soestbergen, M.
    Zaal, J. J. M.
    Hauck, T.
    Dasgupta, A.
    Chen, B.
    MICROELECTRONICS RELIABILITY, 2024, 162
  • [34] Fatigue fracture of SnAgCu solder joints by microstructural modeling
    Erinc, M.
    Assman, T. M.
    Schreurs, P. J. G.
    Geers, M. G. D.
    INTERNATIONAL JOURNAL OF FRACTURE, 2008, 152 (01) : 37 - 49
  • [35] Thermal fatigue mechanisms of CSP solder joints on PWB
    Ohta, H
    Nishimura, N
    NEC RESEARCH & DEVELOPMENT, 2003, 44 (03): : 246 - 250
  • [36] Characterization and fatigue damage simulation in SAC solder joints
    Erinc, M
    Schreurs, PJG
    Zhang, GQ
    Geers, MGD
    MICROELECTRONICS RELIABILITY, 2004, 44 (9-11) : 1287 - 1292
  • [37] Survey on Fatigue Life Prediction of BGA Solder Joints
    Qiu, Baojun
    Xiong, Jingang
    Wang, Han
    Zhou, Shuai
    Yang, Xiuding
    Lin, Zhengpei
    Liu, Maolin
    Cai, Nian
    ELECTRONICS, 2022, 11 (04)
  • [38] Creep fatigue models of solder joints: A critical review
    Wong, E. H.
    van Driel, W. D.
    Dasgupta, A.
    Pecht, M.
    MICROELECTRONICS RELIABILITY, 2016, 59 : 1 - 12
  • [39] Tensile and fatigue strength of solder joints in titanium.
    Bae, TS
    Kim, TJ
    Choi, JH
    Park, CW
    Ohkawa, S
    Kondo, S
    Watari, F
    JOURNAL OF DENTAL RESEARCH, 1996, 75 : 344 - 344
  • [40] Fatigue fracture of SnAgCu solder joints by microstructural modeling
    M. Erinc
    T. M. Assman
    P. J. G. Schreurs
    M. G. D. Geers
    International Journal of Fracture, 2008, 152 : 37 - 49
12345