FATIGUE PROPERTIES OF SOLDER JOINTS

被引:0
|
作者
WILD, RN
机构
关键词
D O I
暂无
中图分类号
TF [冶金工业];
学科分类号
0806 ;
摘要
引用
收藏
页码:S521 / &
相关论文
共 50 条
  • [21] A Mechanistic Thermal Fatigue Model for SnAgCu Solder Joints
    Borgesen, Peter
    Wentlent, Luke
    Hamasha, Sa'd
    Khasawneh, Saif
    Shirazi, Sam
    Schmitz, Debora
    Alghoul, Thaer
    Greene, Chris
    Yin, Liang
    JOURNAL OF ELECTRONIC MATERIALS, 2018, 47 (05) : 2526 - 2544
  • [22] Microstructure evolution and thermomechanical fatigue life of solder joints
    Goldstein, B
    Jerina, KL
    Sastry, SML
    FATIGUE AND FRACTURE MECHANICS: TWENTY-NINTH VOLUME, 1999, 1332 : 786 - 801
  • [23] Predicting thermal fatigue lifetimes for SMT solder joints
    Sauber, J.
    Seyyedi, J.
    Journal of Electronic Packaging, Transactions of the ASME, 1992, 114 (04): : 472 - 476
  • [24] Low Cycle Fatigue Behavior of SnAgCu Solder Joints
    Wang Chao
    Zhu Yongxin
    Li Xiaoyan
    Gao Ruiting
    RARE METAL MATERIALS AND ENGINEERING, 2016, 45 (04) : 828 - 834
  • [25] Thermomechanical fatigue damage evolution in SAC solder joints
    Matin, M. A.
    Vellinga, W. P.
    D Geers, M. G.
    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2007, 445 : 73 - 85
  • [26] Sensitivity Analysis for the Dependence of Solder Joints Fatigue Life
    Hu, Weiwei
    Liu, Chenyan
    Sun, Yufeng
    Zhao, Guangyan
    2013 PROGNOSTICS AND HEALTH MANAGEMENT CONFERENCE (PHM), 2013, 33 : 553 - 558
  • [27] A Mechanistic Thermal Fatigue Model for SnAgCu Solder Joints
    Peter Borgesen
    Luke Wentlent
    Sa’d Hamasha
    Saif Khasawneh
    Sam Shirazi
    Debora Schmitz
    Thaer Alghoul
    Chris Greene
    Liang Yin
    Journal of Electronic Materials, 2018, 47 : 2526 - 2544
  • [28] A DAMAGE INTEGRAL APPROACH TO THERMAL FATIGUE OF SOLDER JOINTS
    SUBRAHMANYAN, R
    WILCOX, JR
    LI, CY
    IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1989, 12 (04): : 480 - 491
  • [29] Importance of Creep Fatigue Interaction in Reliability of Solder Joints
    Zanella, Stephan
    des Etangs-Levallois, Aurelien Lecavelier
    Charkaluk, Eric
    Maia Filho, Wilson Carlos
    Constantinescu, Andrei
    2018 7TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC), 2018,
  • [30] Thermal fatigue modelling for SnAgCu and SnPb solder joints
    Dudek, R
    Walter, H
    Doering, R
    Michel, B
    THERMAL AND MECHANICAL SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS, 2004, : 557 - 564