LOW-TEMPERATURE DEPOSITION OF SILICON-NITRIDE USING UHV ELECTRON-CYCLOTRON RESONANCE PLASMA

被引:0
|
作者
DZIOBA, S [1 ]
MARGITTAI, A [1 ]
SHEPHERD, FR [1 ]
机构
[1] BELL NO RES,OTTAWA K1Y 4H7,ONTARIO,CANADA
关键词
D O I
暂无
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
引用
收藏
页码:C450 / C450
页数:1
相关论文
共 50 条
  • [41] Dielectric properties of silicon nitride films deposited by microwave electron cyclotron resonance plasma chemical vapor deposition at low temperature
    Ye, C
    Ning, ZY
    Shen, MG
    Wang, H
    Gan, ZQ
    APPLIED PHYSICS LETTERS, 1997, 71 (03) : 336 - 337
  • [42] Low-temperature deposition of hydrogenated amorphous silicon in an electron cyclotron resonance reactor for flexible displays
    Flewitt, AJ
    Milne, WI
    PROCEEDINGS OF THE IEEE, 2005, 93 (07) : 1364 - 1373
  • [43] ELECTRON-CYCLOTRON RESONANCE ASSISTED LOW-TEMPERATURE ULTRAHIGH-VACUUM CHEMICAL VAPOR-DEPOSITION OF SI USING SILANE
    MUI, DSL
    FANG, SF
    MORKOC, H
    APPLIED PHYSICS LETTERS, 1991, 59 (15) : 1887 - 1889
  • [44] PLASMA DEPOSITION OF SILICON-NITRIDE
    HIROSE, M
    JAPAN ANNUAL REVIEWS IN ELECTRONICS COMPUTERS & TELECOMMUNICATIONS, 1983, 8 : 85 - 96
  • [45] CHARACTERIZATION OF ELECTRON-CYCLOTRON RESONANCE PROCESS PLASMA AND FILM DEPOSITION
    MIYAKE, S
    CHEN, W
    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 1991, 139 : 294 - 301
  • [46] PLASMA DEPOSITION OF SILICON-NITRIDE
    FAKIH, C
    BES, RS
    ARMAS, B
    THENEGAL, D
    JOURNAL DE PHYSIQUE IV, 1991, 1 (C2): : 413 - 420
  • [47] Chemically flexible precursors allow low-temperature silicon-nitride deposition process
    不详
    LASER FOCUS WORLD, 1998, 34 (01): : 9 - 9
  • [48] OXIDATION OF SILICON-NITRIDE PREPARED BY PLASMA-ENHANCED CHEMICAL-VAPOR-DEPOSITION AT LOW-TEMPERATURE
    LIAO, WS
    LIN, CH
    LEE, SC
    APPLIED PHYSICS LETTERS, 1994, 65 (17) : 2229 - 2231
  • [49] LOW-TEMPERATURE DEPOSITION OF SILICON-NITRIDE BY REACTIVE ION-BEAM SPUTTERING
    BOUCHIER, D
    GAUTHERIN, G
    SCHWEBEL, C
    BOSSEBOEUF, A
    AGIUS, B
    RIGO, S
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1983, 130 (03) : 638 - 644
  • [50] LOW-TEMPERATURE DEPOSITION OF TIN USING TETRAKIS(DIMETHYLAMIDO)-TITANIUM IN AN ELECTRON-CYCLOTRON-RESONANCE PLASMA PROCESS
    WEBER, A
    NIKULSKI, R
    KLAGES, CP
    GROSS, ME
    BROWN, WL
    DONS, E
    CHARATAN, RM
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1994, 141 (03) : 849 - 853