STRUCTURE AND PROPERTIES OF REACTIVELY BONDED THICK-FILM GOLD CONDUCTORS

被引：2

|

作者：

COLEMAN, MV

GURNETT, GE

机构：

来源：

ELECTROCOMPONENT SCIENCE AND TECHNOLOGY | 1978年 / 5卷 / 01期

关键词：

D O I：

10.1155/APEC.5.55

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

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页码：55 / 59

页数：5

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