ULTRASONIC ALUMINUM WIRE BONDING OF ALLOYED GOLD THICK-FILM CONDUCTORS

被引：0

作者：

VERMA, KK ^{[1
]}

机构：

[1] ENGELHARD IND,E NEWARK,NJ

来源：

AMERICAN CERAMIC SOCIETY BULLETIN | 1980年 / 59卷 / 03期

关键词：

D O I：

暂无

中图分类号：

TQ174 [陶瓷工业]; TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

引用

页码：379 / 379

页数：1

共 50 条

[1] ALLOY ELEMENT ADDITIONS TO GOLD THICK-FILM CONDUCTORS - EFFECTS ON INDIUM-LEAD SOLDERING AND ULTRASONIC ALUMINUM WIRE BONDING
HOROWITZ, SJ
GERRY, DJ
COTE, RE
[J]. SOLID STATE TECHNOLOGY, 1978, 21 (01) : 47 - 54
[2] DIE AND WIRE BONDING CAPABILITIES OF REPRESENTATIVE THICK-FILM CONDUCTORS
BUDD, JP
[J]. SOLID STATE TECHNOLOGY, 1969, 12 (06) : 59 - &
[3] ALLOYED THICK-FILM GOLD CONDUCTOR FOR HIGH-RELIABILITY HIGH-YIELD WIRE BONDING
HOROWITZ, SJ
FELTEN, JJ
GERRY, DJ
[J]. IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1979, 2 (04): : 460 - 466
[4] INFLUENCE OF MANUFACTURING PROCESSES ON ULTRASONIC BONDABILITY OF THICK-FILM GOLD CONDUCTORS
COLLANDER, P
LAURINOLLI, T
JARVINEN, E
WEISSENFELT, M
[J]. SOLID STATE TECHNOLOGY, 1980, 23 (06) : 85 - 89
[5] HIGH-PERFORMANCE THICK-FILM GOLD CONDUCTORS
GETTY, RR
TAYLOR, BE
NEEDES, CRS
[J]. SOLID STATE TECHNOLOGY, 1983, 26 (10) : 163 - 168
[6] ULTRASONIC ALUMINUM WIRE BONDING TO COPPER CONDUCTORS.
Pitt, V.A.
Needes, C.R.S.
Johnson, R.W.
[J]. Insulation, circuits, 1981, 27 (12): : 51 - 55
[7] STRUCTURE AND PROPERTIES OF REACTIVELY BONDED THICK-FILM GOLD CONDUCTORS
COLEMAN, MV
GURNETT, GE
[J]. ELECTROCOMPONENT SCIENCE AND TECHNOLOGY, 1978, 5 (01): : 55 - 59
[8] LIMITATIONS OF REACTIVELY-BONDED THICK-FILM GOLD CONDUCTORS
COLEMAN, MV
GURNETT, GE
[J]. SOLID STATE TECHNOLOGY, 1979, 22 (03) : 45 - 51
[9] ADHERENCE OF THICK-FILM CONDUCTORS
BECHER, PF
[J]. REPORT OF NRL PROGRESS, 1976, (DEC): : 36 - 37
[10] ADVANCES IN THICK-FILM CONDUCTORS
STEIN, SJ
SPADAFORA, L
HUANG, C
[J]. AMERICAN CERAMIC SOCIETY BULLETIN, 1977, 56 (03): : 325 - 325

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