ULTRASONIC ALUMINUM WIRE BONDING TO COPPER CONDUCTORS.

被引:0
|
作者
Pitt, V.A.
Needes, C.R.S.
Johnson, R.W.
机构
来源
Insulation, circuits | 1981年 / 27卷 / 12期
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页码:51 / 55
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  • [1] Explosive Welding, a New Bonding Technique for Aluminum Conductors.
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  • [3] WIRE WRAPPING OF ALUMINIUM CONDUCTORS.
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  • [4] Electromigration in Aluminum Printed Conductors.
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  • [5] THERMOSONIC GOLD WIRE BONDING TO COPPER CONDUCTORS
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  • [7] HOW TO TERMINATE ALUMINUM CONDUCTORS.
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