SINTERING BEHAVIOR OF A REACTIVELY BONDED THICK-FILM GOLD INK

被引：7

|

作者：

NORDSTROM, TV

YOST, FG

机构：

来源：

JOURNAL OF ELECTRONIC MATERIALS | 1978年 / 7卷 / 01期

关键词：

D O I：

10.1007/BF02656023

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

收藏

页码：109 / 122

页数：14

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