共 50 条
- [12] APPLICATION OF HIGH-RATE EXB OR MAGNETRON SPUTTERING IN METALLIZATION OF SEMICONDUCTOR-DEVICES JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1976, 13 (01): : 157 - 164
- [14] SEQUENCE TEST METHOD FOR RELIABILITY EVALUATION OF SEMICONDUCTOR-DEVICES MICROELECTRONICS AND RELIABILITY, 1981, 21 (02): : 225 - 229
- [15] STRESS-INDUCED DEFORMATION OF ALUMINUM METALLIZATION IN PLASTIC MOLDED SEMICONDUCTOR-DEVICES IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1985, 8 (04): : 427 - 434
- [18] LIGHTWAVE SEMICONDUCTOR-DEVICES FUJITSU SCIENTIFIC & TECHNICAL JOURNAL, 1988, 24 (04): : 345 - 358
- [19] POWER SEMICONDUCTOR-DEVICES IEE PROCEEDINGS-I COMMUNICATIONS SPEECH AND VISION, 1985, 132 (06): : 237 - 237