SIMULATION OF A TRIODE PLASMA-ASSISTED CHEMICAL-VAPOR-DEPOSITION SYSTEM

被引:0
|
作者
VANBREDA, JH
DIAS, AG
HAIJE, WG
SCHRAM, DC
机构
[1] JOINT RES CTR,INST ADV MAT,DIV MAT ENGN,1755 ZG PETTEN,NETHERLANDS
[2] EINDHOVEN UNIV TECHNOL,DEPT PHYS,5600 MB EINDHOVEN,NETHERLANDS
来源
SURFACE & COATINGS TECHNOLOGY | 1995年 / 74-5卷 / 1-3期
关键词
PACVD; PIC; CIC; TIN; AFM;
D O I
10.1016/0257-8972(95)08302-2
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
The behaviour of a triode plasma-assisted chemical vapour deposition (PACVD) system was studied with a newly developed simulation program based upon a one-dimensional particle (cloud in cell) model, The simulations were performed with argon as process gas to focus on the behaviour of the system without having to deal with complicated plasma chemistry. The simulations show that it is possible to control the production (and transport) of reactive species and the ion bombardment independently using the freedom to choose the total pressure, the r.f, amplitude and the d.c. voltage. In combination with these simulations a number of experiments were done where TiN was deposited on molybdenum substrates. The surface topology of these coatings, as analysed with atomic force microscopy, changes with increasing pressure from 'egg'-like to columnar.
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页码:232 / 237
页数:6
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