THIN-FILM ADHESION - A REVIEW OF THE MECHANICAL METHODS FOR ADHESION ASSESSMENT

被引：0
|
作者：
STEINMANN, PA [1 ]
HINTERMANN, HE [1 ]
机构：
[1] SWISS CTR ELECTR & MICROTECHNOL INC,CH-2007 NEUCHATEL,SWITZERLAND
来源：
JOURNAL OF THE ELECTROCHEMICAL SOCIETY | 1988年 / 135卷 / 08期
关键词：
D O I：
暂无
中图分类号：
O646 [电化学、电解、磁化学];
学科分类号：
081704 ;
摘要：
引用
收藏
页码：C358 / C358
页数：1
相关论文
共 50 条
  • [1] A REVIEW OF THE MECHANICAL TESTS FOR ASSESSMENT OF THIN-FILM ADHESION
    STEINMANN, PA
    HINTERMANN, HE
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1989, 7 (03): : 2267 - 2272
  • [2] THIN-FILM ADHESION
    CHAPMAN, BN
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1974, 11 (01): : 106 - 113
  • [3] ADHESION OF THIN-FILM CIRCUITS
    TAYLOR, GM
    SOLID STATE TECHNOLOGY, 1980, 23 (11) : 92 - 94
  • [4] MEASUREMENT OF THIN-FILM ADHESION
    HULL, TR
    COLLIGON, JS
    HILL, AE
    VACUUM, 1987, 37 (3-4) : 327 - 330
  • [5] ENHANCEMENT OF THIN-FILM ADHESION
    MITCHELL, IV
    CIM BULLETIN, 1984, 77 (866): : 43 - 43
  • [6] KINETICS OF THIN-FILM ADHESION
    JEONG, HS
    WHITE, RC
    ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 1993, 206 : 175 - POLY
  • [7] CHARGE EFFECTS IN THIN-FILM ADHESION
    VONHARRACH, HG
    CHAPMAN, BN
    THIN SOLID FILMS, 1972, 13 (01) : 157 - +
  • [8] DEVICE FOR MEASURING ADHESION OF THIN-FILM
    LABUNOV, VA
    LESHCHENKO, IN
    UVAROV, AR
    INDUSTRIAL LABORATORY, 1979, 45 (04): : 481 - 482
  • [9] VARIATIONAL PRINCIPLE OF THIN-FILM ADHESION
    JEONG, HS
    WHITE, RC
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1993, 11 (04): : 1373 - 1376
  • [10] Adhesion and thin-film module reliability
    McMahon, T. J.
    Jorgensen, G. J.
    CONFERENCE RECORD OF THE 2006 IEEE 4TH WORLD CONFERENCE ON PHOTOVOLTAIC ENERGY CONVERSION, VOLS 1 AND 2, 2006, : 2062 - +
12345