THIN-FILM ADHESION

被引：150

作者：

CHAPMAN, BN ^{[1
]}

机构：

[1] UNIV LONDON, IMPERIAL COLL, LONDON, ENGLAND

来源：

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY | 1974年 / 11卷 / 01期

关键词：

D O I：

10.1116/1.1318537

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

引用

页码：106 / 113

页数：8

共 50 条

[1] ADHESION OF THIN-FILM CIRCUITS
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[J]. SOLID STATE TECHNOLOGY, 1980, 23 (11) : 92 - 94
[2] MEASUREMENT OF THIN-FILM ADHESION
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[J]. VACUUM, 1987, 37 (3-4) : 327 - 330
[3] ENHANCEMENT OF THIN-FILM ADHESION
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[J]. CIM BULLETIN, 1984, 77 (866): : 43 - 43
[4] KINETICS OF THIN-FILM ADHESION
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[5] CHARGE EFFECTS IN THIN-FILM ADHESION
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[J]. THIN SOLID FILMS, 1972, 13 (01) : 157 - +
[6] DEVICE FOR MEASURING ADHESION OF THIN-FILM
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[J]. INDUSTRIAL LABORATORY, 1979, 45 (04): : 481 - 482
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[J]. CONFERENCE RECORD OF THE 2006 IEEE 4TH WORLD CONFERENCE ON PHOTOVOLTAIC ENERGY CONVERSION, VOLS 1 AND 2, 2006, : 2062 - +
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[J]. VACUUM, 1992, 43 (5-7) : 517 - 520
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