THIN-FILM ADHESION - A REVIEW OF THE MECHANICAL METHODS FOR ADHESION ASSESSMENT

被引：0
|
作者：
STEINMANN, PA [1 ]
HINTERMANN, HE [1 ]
机构：
[1] SWISS CTR ELECTR & MICROTECHNOL INC,CH-2007 NEUCHATEL,SWITZERLAND
来源：
JOURNAL OF THE ELECTROCHEMICAL SOCIETY | 1988年 / 135卷 / 08期
关键词：
D O I：
暂无
中图分类号：
O646 [电化学、电解、磁化学];
学科分类号：
081704 ;
摘要：
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页码：C358 / C358
页数：1
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