THERMAL IMPEDANCE OF CERAMIC PACKAGES USING BEAM-LEAD IC CHIPS

被引：0
|
作者：
HARDWICK, NE
机构：
来源：
IEEE TRANSACTIONS ON ELECTRON DEVICES | 1969年 / ED16卷 / 02期
关键词：
D O I：
10.1109/T-ED.1969.16675
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：247 / &
相关论文
共 34 条
  • [21] Fluxless Bonding of Large Silicon Chips to Ceramic Packages Using Electroplated Eutectic Au/Sn/Au Structures
    Pin J. Wang
    Jong S. Kim
    Chin C. Lee
    Journal of Electronic Materials, 2009, 38 : 2106 - 2111
  • [22] Fluxless Bonding of Large Silicon Chips to Ceramic Packages Using Electroplated Eutectic Au/Sn/Au Structures
    Wang, Pin J.
    Kim, Jong S.
    Lee, Chin C.
    JOURNAL OF ELECTRONIC MATERIALS, 2009, 38 (10) : 2106 - 2111
  • [23] Comparison of diodes and resistors for measuring chip temperature during thermal characterization of electronic packages using thermal test chips
    Claassen, A
    Shaukatullah, H
    THIRTEENTH ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM, PROCEEDINGS 1997, 1997, : 198 - 209
  • [24] MASS BONDING IN INTEGRATED-CIRCUIT PACKAGE ASSEMBLY .1. THERMOCOMPRESSION BONDING OF BEAM-LEAD CHIP ARRAYS TO INTERCONNECT CIRCUITRY ON CERAMIC SUBSTRATES
    BOYER, JA
    BURNS, JA
    WESTERN ELECTRIC ENGINEER, 1979, 23 (03): : 3 - 10
  • [25] Detailed Analysis of IC Packages Using Thermal Transient Testing and CFD Modelling for Communication Device Applications
    Fang Yake
    Gang, Wang
    Chen, Xiaodan
    Hon, Wong Voon
    Fu, Xing
    Andras, Vass-Varnai
    2016 22ND INTERNATIONAL WORKSHOP ON THERMAL INVESTIGATIONS OF ICS AND SYSTEMS (THERMINIC), 2016, : 164 - 168
  • [26] Thermal efficiency enhancement using a ceramic coating on the cylinder liner and the piston head of the IC engine
    Anand P.
    Rajesh D.
    Shunmugasundaram M.
    Saranraj I.
    International Journal of Ambient Energy, 2021, 42 (13) : 1474 - 1483
  • [27] Hot embossing and thermal bonding of poly(methyl methacrylate) microfluidic chips using positive temperature coefficient ceramic heater
    Xia Wang
    Luyan Zhang
    Gang Chen
    Analytical and Bioanalytical Chemistry, 2011, 401 : 2657 - 2665
  • [28] Hot embossing and thermal bonding of poly(methyl methacrylate) microfluidic chips using positive temperature coefficient ceramic heater
    Wang, Xia
    Zhang, Luyan
    Chen, Gang
    ANALYTICAL AND BIOANALYTICAL CHEMISTRY, 2011, 401 (08) : 2657 - 2665
  • [29] Current density and hot spot prediction using electrical-thermal co-simulation for multi-layer IC packages
    Chee-Hoe, Lin
    Wui-Weng, Wong
    Bao-Min, Liu
    EPTC 2006: 8TH ELECTRONIC PACKAGING TECHNOLOGY CONFERENCE, VOLS 1 AND 2, 2006, : 849 - 852
  • [30] Characterization of Lead-Free Solder and Sintered Nano-Silver Die-Attach Layers Using Thermal Impedance
    Cao, Xiao
    Wang, Tao
    Ngo, Khai D. T.
    Lu, Guo-Quan
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2011, 1 (04): : 495 - 501
1234