THERMAL IMPEDANCE OF CERAMIC PACKAGES USING BEAM-LEAD IC CHIPS

被引：0

作者：

HARDWICK, NE

机构：

来源：

IEEE TRANSACTIONS ON ELECTRON DEVICES | 1969年 / ED16卷 / 02期

关键词：

D O I：

10.1109/T-ED.1969.16675

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：247 / &

共 34 条

[1] THERMAL IMPEDANCE OF CERAMIC PACKAGES USING BEAM-LEAD IC CHIPS
HARDWICK, NE
PROCEEDINGS OF THE IEEE, 1969, 57 (09) : 1616 - &
[2] THERMAL CHARACTERISTICS OF BEAM-LEAD CHIPS
GOWER, RL
IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1972, PHP8 (02): : 39 - &
[3] ANALYSIS OF THERMAL IMPEDANCE FOR CONVENTIONAL AND BEAM LEAD IC CHIPS
EBRAHIMI, J
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1971, ED18 (12) : 1139 - +
[4] USING BEAM-LEAD PIN DIODES
不详
MICROWAVES & RF, 1994, 33 (10) : 124 - 124
[5] THERMAL ANALYSIS OF BEAM-LEAD TRANSISTOR CHIP
KANI, K
KAMOSHID.M
SATO, K
OKADA, T
NEC RESEARCH & DEVELOPMENT, 1971, (21): : 90 - +
[6] NOVEL FAILURE MECHANISM AND ANOMALOUS ACCELERATION FACTOR ON A BEAM-LEAD IC
SCARFF, PL
IANNUZZIGLOGOVSKY, M
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1989, 12 (01): : 144 - 151
[7] ASSEMBLING BEAM-LEAD SEALED-JUNCTION INTEGRATED-CIRCUIT PACKAGES
ELEFTHERION, MP
SOLID STATE TECHNOLOGY, 1968, 11 (08) : 27 - +
[8] Nonradiative dielectric waveguide circuit components using beam-lead diodes
Kuroki, Futoshi
Yoneyama, Tsukasa
Electronics and Communications in Japan, Part II: Electronics (English translation of Denshi Tsushin Gakkai Ronbunshi), 1990, 73 (09): : 35 - 41
[9] Thermal stress measurement in silicon chips encapsulated in IC plastic packages under temperature cycling
Miura, Hideo
Kitano, Makoto
Nishimura, Asao
Kawai, Sueo
Journal of Electronic Packaging, Transactions of the ASME, 1993, 115 (01): : 9 - 15
[10] Thermal modeling and analysis for Ceramic Quad Flat No-lead packages
Bo, Peng
Yang Zhentao
Lu, Zhao
2015 16TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, 2015,

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