THE EFFECTS OF SUBSTRATE HEATING AND ION CLEANING ON THICK-FILM ADHESION

被引：12
|
作者：
COAD, JP
DUGDALE, RA
MARTINDALE, LP
机构：
来源：
VACUUM | 1981年 / 31卷 / 8-9期
关键词：
D O I：
10.1016/S0042-207X(81)80044-9
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
引用
收藏
页码：365 / 370
页数：6
相关论文
共 50 条
  • [1] ADHESION OF THICK-FILM CONDUCTORS - MECHANISMS AND PROCESSING EFFECTS
    BECHER, PF
    AMERICAN CERAMIC SOCIETY BULLETIN, 1979, 58 (03): : 363 - 363
  • [2] SOLDERABILITY OF THICK-FILM SUBSTRATE
    YOSHIYA, T
    TAMURA, A
    WELDING JOURNAL, 1977, 56 (11) : S359 - S363
  • [3] ADHESION MECHANISMS OF THICK-FILM CONDUCTORS
    KIM, HG
    ROTHLINGSHOFER, W
    TOMANDL, G
    SOLID STATE TECHNOLOGY, 1979, 22 (03) : 62 - 66
  • [4] FRACTURE APPROACH TO THICK-FILM ADHESION MEASUREMENTS
    BASCOM, WD
    BITNER, JL
    JOURNAL OF MATERIALS SCIENCE, 1977, 12 (07) : 1401 - 1410
  • [5] A METHOD OF ADHESION STRENGTH TEST FOR THICK-FILM
    YATA, K
    ENOKIDO, Y
    YAMAGUCHI, T
    IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1993, 16 (06): : 584 - 591
  • [6] THICK-FILM PASTE ADHESION AND THERMAL CYCLING
    ACTERMAN, JS
    OLSEN, CE
    YOUNG, WS
    AMERICAN CERAMIC SOCIETY BULLETIN, 1979, 58 (03): : 363 - 363
  • [7] EFFECTS OF ION MIGRATION AND ELECTROLYSIS IN THICK-FILM ELECTRODES FABRICATION
    BREHIER, PC
    BELFORD, RE
    ANALYTICAL PROCEEDINGS, 1995, 32 (08): : 327 - 328
  • [8] DIAMOND - A NOVEL SUBSTRATE FOR THICK-FILM TECHNOLOGY
    LUX, H
    SMETANA, W
    SURFACE & COATINGS TECHNOLOGY, 1991, 47 (1-3): : 553 - 558
  • [9] ENHANCING THICK-FILM ADHESION ON ALUMINA CERAMIC.
    Bischoff, Bill
    Petit, Ray
    Electronic Packaging and Production, 1987, 27 (03): : 97 - 98
  • [10] REPRODUCIBLE ADHESION TEST FOR SOLDERED THICK-FILM CONDUCTORS
    HITCH, TT
    AMERICAN CERAMIC SOCIETY BULLETIN, 1980, 59 (03): : 378 - 378
12345