THE EFFECTS OF SUBSTRATE HEATING AND ION CLEANING ON THICK-FILM ADHESION

被引:12
|
作者
COAD, JP
DUGDALE, RA
MARTINDALE, LP
机构
关键词
D O I
10.1016/S0042-207X(81)80044-9
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
引用
收藏
页码:365 / 370
页数:6
相关论文
共 50 条
  • [21] GALVANIC EFFECTS IN THICK-FILM DIELECTRIC LAYERS
    SHORT, OA
    HOFFMAN, LC
    ROSENBERG, RM
    AMERICAN CERAMIC SOCIETY BULLETIN, 1973, 52 (09): : 713 - 714
  • [22] PIEZORESISTIVE EFFECTS IN THICK-FILM RESISTORS.
    Canali, C.
    Malavasi, D.
    Morten, B.
    Prudenziati, M.
    Taroni, A.
    1600, (51):
  • [23] EVALUATION OF A THICK-FILM SYSTEM FOR CHIP CARRIER SUBSTRATE USE
    DETTMER, ES
    AMERICAN CERAMIC SOCIETY BULLETIN, 1981, 60 (09): : 932 - 932
  • [24] INFLUENCE OF THE SUBSTRATE ON THE ELECTRICAL-PROPERTIES OF THICK-FILM RESISTORS
    CATTANEO, A
    PIROZZI, L
    MORTEN, B
    PRUDENZIATI, M
    IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1980, 3 (01): : 181 - 186
  • [25] GALVANIC EFFECTS IN THICK-FILM DIELECTRIC LAYERS
    SHORT, OA
    HOFFMAN, LC
    ROSENBERG, RM
    AMERICAN CERAMIC SOCIETY BULLETIN, 1973, 52 (04): : 377 - 377
  • [26] THICK-FILM TECHNOLOGY
    PRUDENZIATI, M
    SENSORS AND ACTUATORS A-PHYSICAL, 1991, 25 (1-3) : 227 - 234
  • [27] THICK-FILM CIRCUITS
    ISERT, H
    ELEKTROTECHNISCHE ZEITSCHRIFT B-AUSGABE, 1972, 24 (04): : 85 - &
  • [28] THICK-FILM TECHNOLOGY
    OCONNELL, JA
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1967, 4 (05): : 331 - &
  • [29] Thick-film sensors
    White, N
    Turner, J
    MEASUREMENT SCIENCE AND TECHNOLOGY, 1997, 8 (01) : U3 - U3
  • [30] THICK-FILM TECHNOLOGY
    FUNK, W
    PHILIPS TECHNICAL REVIEW, 1975, 35 (05): : 144 - 150